Products

6 Products in Encapsulants

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H.B. Fuller EA6114 banner

H.B. Fuller EA6114

Chemical Family:Polyurethane Acrylate
Product Type:Radiation Curable Adhesive, 1K (1 component) Adhesive, Encapsulant
Application Area:Electronic Components
Compatible Substrates & Surfaces:Glass, Metal, Plastics
Features:Fast Curing, Good Adhesion, Tack-free, Improved Productivity, Flexible, High Performance, UV Curable, Medium Viscosity, Bright Fluorescence, Easy To Dispense, Electrical Insulation Properties, High Jetness

H.B. Fuller EA6114 is a high-performance, fluorescence, fast UV/moisture dual-cure adhesive/encapsulant. It is optimized for fast moisture curing, supporting increased manufacturing productivity. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. This product has a tack-free surface finish and has shown excellent adhesion and flexibility. It can be moisture-cured in shadowed areas.

H.B. Fuller FH8302 banner

H.B. Fuller FH8302

Product Type:Epoxy Adhesive, Underfill Adhesive, 1K (1 component) Adhesive, Encapsulant
Application Area:Flip Chip Applications, Printed Circuit Boards
Features:Excellent Flowability, Good Adhesion, Electrically Insulating, High Reliability, High Glass Transition Temperature, High Modulus

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller 1521 banner

H.B. Fuller 1521

Chemical Family:Silicones
Product Type:2K (2 component) Adhesive, Reactive Adhesive, Potting Compound, Encapsulant
Application Area:Rail Bonding, Batteries, Turbines, Electronic Components, PV Modules, HVAC Applications, Junction Boxes, Ingot Bonding, Energy Storage, Frame Sealing, Solar Panel, Edge Gluing, Blades, Lithium-Ion Battery, Module Installation
Compatible Substrates & Surfaces:Glass
Features:Room Temperature Curing, Rapid Cure Response, Good Electrical Properties, Fast Cure, Good Thick Section Cure, Good Adhesion, Enhanced Damp Proofing, Excellent Sealing Capability

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

H.B. Fuller FH8800 banner

H.B. Fuller FH8800

Chemical Family:Epoxides, Epoxy & Epoxy Derivatives
Product Type:Reactive Adhesive, Potting Compound, 1K (1 component) Adhesive
Application Area:LED Modules, Semiconductor Die Attach, Die/Chip Attach
Features:Good Adhesion

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller FH8301 banner

H.B. Fuller FH8301

Product Type:Epoxy Adhesive, Underfill Adhesive, 1K (1 component) Adhesive, Encapsulant
Application Area:Flip Chip Applications, Printed Circuit Boards
Features:Good Adhesion, Electrically Insulating, High Reliability, High Glass Transition Temperature, High Modulus

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller EA6042 banner

H.B. Fuller EA6042

Chemical Family:Polyurethane Acrylate
Product Type:Radiation Curable Adhesive, 1K (1 component) Adhesive, Encapsulant
Application Area:Electronic Components
Compatible Substrates & Surfaces:Glass, Metal, Plastics
Features:Fast Curing, Good Adhesion, Tack-free, Flexible, High Performance, Medium Viscosity, Bright Fluorescence, Easy To Dispense, Electrical Insulation Properties, High Jetness

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.