H.B. Fuller FH8800

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

Chemical Family: Epoxides, Epoxy & Epoxy Derivatives

Product Type: 1K (1 component) Adhesive, Potting Compound, Reactive Adhesive

Application Area: Die/Chip Attach, LED Modules, Semiconductor Die Attach

Features: Good Adhesion

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features

Applications & Uses

Markets
Applications
Application Area
Cure Method
Typical Applications
  • LED Die attach
Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at 2-8℃.
4. We do not recommend thawing material more than three times.

Clean-Up

Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Properties

Color (Properties)
Physical Properties of Cured Material
ValueUnitsTest Method / Conditions
Hardness (curing at 100°C, 30min)82.0-ASTM D-2240, Shore D
Elongation at Break (curing at 100°C, 30min)1.8%ASTM D-0412
Transition Temperature (curing at 100°C, 30min)142.0°C-
Coefficient of Thermal Expansion (Alpha 1, curing at 100°C, 30min)85.0m/m.°CASTM E-831
Coefficient of Thermal Expansion (Aplha 2, curing at 100°C, 30min)171.0m/m.°CASTM E-831
Water Absorption (at 24 h, curing at 100°C, 30min)0.12%-
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength16.3kV/mmASTM D-149
Surface Resistivity2.0 x 10¹⁶ohmASTM D-257
Volume Resistivity5.6 x 10¹⁶Ω.cmASTM D-257
Uncured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.05--
Viscosity (Brookfield CP52, 100 rpm, at 25°C)3175.0cP-
Working Pot Life7.0days-

Technical Details & Test Data

Curing Profile
  • Recommended cure conditions:
    • 10 minutes @ 120℃
    • 30 minutes @ 100℃
  • Curing speed will vary depending on oven temperatures profile efficiency.

Packaging & Availability

Regional Availability
  • Africa
  • Asia Pacific (Excluding Russia)
  • Europe (Excluding Russia)
  • India
  • Latin America
  • Middle East
  • North America

Storage & Handling

Shelf Life
6 Months
Storage Conditions

FH8800 is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.