Products

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

Tonsan® 1533 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has excellent dielectric properties and V1 flame retardancy.

Rakoll® 2365F is a highly effective water-based PVAc adhesive that offers fast curing, exceptional bonding strength, and excellent resistance to solvents. This adhesive is widely utilized in the woodworking industry for various applications, such as wood assembly and furniture component bonding.

Körapur® 140 is a single-component, elastic, moisture-curing polyurethane adhesive used for bonding and sealing primered and varnished metals, aluminum, wooden materials, and duroplastics. This high-strength, elastic adhesive has excellent properties such as high cold resistance, high heat resistance, excellent moisture resistance, and excellent weather resistance.

Flextra® WD4127LV is a one-part system adhesive with a fast cure speed and a long pot life. It exhibits good adhesion to foil and is commonly used for flexible packaging applications, including bonding paper to film, paper to foil, and paper lidstock.

H.B. Fuller 80RC is a fast-curing, high-strength anaerobic adhesive. It is used for locking and sealing threads and for retaining cylindrical parts. It allows for larger machining tolerances and is highly resistant to heat, corrosion,vibrations, water, gasses, oils, hydrocarbons, and many chemicals.

TEC® Totalflex XMS is an ultra-high-performance, one-component, moisture-curing modified silane adhesive suitable for various wall tile applications, countertops, and mosaic tile for shower floors. It is specifically designed for challenging applications, including gaged porcelain tile panels and slabs, exterior building facades, submerged use in pools, and clear and transparent glass. Total Flex XMS provides robust non-sag/non-slump adhesion, long open time, and extra smooth troweling. It adheres excellently to a wide range of substrates and tiles, and no mixing is required.

H.B. Fuller 40RC is a fast-curing, high-strength anaerobic adhesive. This green anaerobic retaining compound is used for locking and sealing threads and for retaining cylindrical components. It is highly resistant to heat, corrosion, vibrations, water, gasses, oils, hydrocarbons,and many chemicals.

Cyberbond CB AL 6028 is a two-component methyl methacrylate adhesive. It is especially suited for bonding metals to different plastics and composites. This grade possesses high elasticity and elongation along with a short open time. The mechanical properties range from flexible to rigid.

Tonsan® 3220 is a one-component anaerobic adhesive with high strength and good cold water resistance. It is mainly used to bond silicon rods and polyester sheets. This material is recommended for use in the silicon cutting process by a diamond wire saw to temporarily fix the silicone rod and polyester sheet.

H.B. Fuller SI120 is a surface-insensitive cyanoacrylate adhesive that is used in applications that require faster cure speeds on parts that are dry and on parts that may be acidic. The SI series bonds a wide range of similar and dissimilar surfaces. This series provides exceptional performance in a wide range of applications.

Swift®bond 2846 PR is a PU bonding solution with a solid content of 45%. It is BTX-free and offers extremely fast processing and curing, allowing for efficient production. This adhesive is commonly used in press lamination applications for interior components. It is also available in a black version.

Tonsan® 1521 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has good thermal conductivity and flame retardancy.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8633 is a one-component, thermal-curable adhesive with fast curing at low temperatures, low shrinkage, and high adhesive strength. It can adhere to a variety of substrates and has excellent thermal performance, making it suitable for high-temperature applications. This material also provides high bond strength on various substrates.