H.B. Fuller FH8008

Identification

Chemical Family

Epoxy & Epoxy Derivatives

GBU

HHC

RTU Product Type

Underfill Adhesive,

1K (1 component) Adhesive,

Reactive Adhesive

Categories

Markets → Consumer Goods → Applications → Appliances & Electronics

Technologies → Adhesives & Sealants → Product Families → Bonding Technology → 1K Liquid Reactive Adhesives

Technologies → Adhesives & Sealants → Product Families → Functional Adhesives → Underfills

Application Information

Cure Method

Heat Cure

Applications

Application Area

Electronic Components

Applications & Uses

Clean-Up

Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Seal any remaining material and store immediately at -18℃.
4. We do not recommend thawing material more than three times.

Features

Ready-to-Use Product Features

Excellent Filling Properties,

Good Gap Filling Capabilities,

Fast Cure,

High Reliability

Features & Benefits

Features and Benefits

• Fast cure at moderate temperature minimizing stress on components.
• Reworkable without damage to the attach pad
• High reliability design for portable device
• Single Component

Packaging & Availability

Regional Availability

• Latin America

Physical Properties

Color (Properties)

Black

Properties

Density:

1150 kg/m³

Dielectric Strength:

25 kV/mm

Specific Gravity:

1.15

Typical Properties

	Value	Units	Test Method / Conditions
Storage Temperature	-18	°C	-

Uncured Properties

	Value	Units	Test Method / Conditions
Specific Gravity	1.15	-	-
Viscosity (at 25°C, 100 rpm)	510	cPs	-
Working Pot Life	3	days	-

Cured Properties

	Value	Units	Test Method / Conditions
Coefficient of Thermal Expansion (cured at 120C°, 30 min, alpha 1)	89	m/m.°C	ASTM E831
Coefficient of Thermal Expansion (cured at 120C°, 30 min, alpha 2)	226	m/m.°C	ASTM E-831
Cure Time (at 150°C)	8	minutes	-
Transition Temperature (cured at 120C°, 30 min)	108	°C	-

Electrical Properties

	Value	Units	Test Method / Conditions
Dielectric Strength	25	kV/mm	ASTM D-149
Surface Resistivity	12000000000000000	ohm	ASTM D-257
Volume Resistivity	41000000000000000	Ω-cm	ASTM D-257

Storage & Handling

Storage Conditions

FH8008 is supplied in 30ml/syringes
It should be stored in a -18°C refrigerator.
Shelf life is 6 months from date of manufacture.

Shelf Life

6 months

Technical Details & Test Data

Curing Profile

• Recommended cure conditions:
  • 8 minutes @ 150℃
• Curing speed will vary depending on oven temperatures profile efficiency, printed circuit board thickness