Adhesives & Sealants

H.B. Fuller HL-3163 is a hot melt adhesive that bonds well to a variety of book binding substrates and has excellent heat resistance. This grade can be used in one-shot book binding and is applicable on most paper stocks used in book binding.

H.B. Fuller HL9647 is an isocyanate-free, hot melt, moisture-curing adhesive. This product forms tough, heat-resistant bonds after full cure. Its cure time is a function of moisture availability and ambient temperatures. The typical cure times of this product at a relative humidity of 30 - 60% and ambient temperatures of 60 - 80°F vary from 3 - 10 days, depending on the substrate and coat weight. The open time of this product varies depending on the substrate and method of application. In a thin film, open times range from 2 to 10 seconds, and bead open times range from 30 to 60 seconds. It bonds well to nonpolar plastics, metals, paper, and wood.

H.B. Fuller MP5401 is a one-component, heat-curable, thixotropic epoxy paste adhesive. It is a non-sag adhesive that forms strong bonds to metals and ceramics. H.B. Fuller MP5401 has exceptional thermal stability and resistance to water, humidity, and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating. Its typical uses include permanent magnet motors and loudspeaker assembly, air conditioning joint tubes and processors, high-temperature structural bonding, filter end caps, and side seam assembly.

H.B. Fuller 1581 is a one-component, alcohol-cured RTV silicone sealant. A non-sag material with excellent heat resistance for use in industrial and electronics applications. 1581 has very good adhesion to a wide range of unprimed substrates. High performance with fast and excellent adhesion to glass, aluminum alloys, etc. It can be used for a variety of electronics bonding, encapsulation, and sealing applications. This material is certified by UL to pass HB flame rating testing. This material performs at temperatures ranging from -55°C to 210°C.

H.B. Fuller EH9651B is a reactive hot melt adhesive designed for cell phone touch panel bonding. It offers several features and benefits tailored for this application on portable devices. This adhesive is formulated with a black hue, which is advantageous for touch panel bonding as it helps to enhance the visual appearance and esthetics of the device. In addition to its color, H.B. Fuller EH9651B offers excellent adhesion on most substrates commonly used in portable devices. It is also capable of narrow edge bonding, which is crucial for touch panel applications.

H.B. Fuller EA6042 is a high-performance, fluorescence, fast UV-cure adhesive and encapsulant. This product has a tack-free surface finish and good electrical insulation performance. It has excellent precision dispensing and jetting performance. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. It has excellent adhesion and is flexible.

H.B. Fuller 1599 is a silicone RTV (room temperature vulcanizing) adhesive and sealant that is designed for sealing rigid joints. It offers excellent sealing properties and is suitable for use in applications where a reliable and durable seal is required. This silicone RTV is commonly used for rigid flange sealing in powertrain applications, where sealing joints and preventing leakage are crucial for the proper functioning and performance of the powertrain system.

H.B. Fuller FH8621 is a one-component, low-temperature-curing epoxy adhesive. It features fast curing at a low temperature, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8621 will cure faster with an increased temperature. Additionally, it offers high and low temperature resistance.

H.B. Fuller EV Bond 343 is a medium-hardness, semi-flexible two– component polyurethane adhesive designed for bonding applications requiring resilient bonds, non-sag application and enhanced adhesion to flexible substrates. EV Bond 343 is suitable for bonding metals, ceramics, natural rubber, thermosetting polymers and select types of unprepared thermoplastic substrates such as ABS, polycarbonate and nylon.

H.B. Fuller FH7026 is a two-part, room-temperature-curing acrylic adhesive. This material is designed to meet the requirements for structural bonding in electronic assemblies. It cures rapidly at room temperature, and the cure times can be reduced with the addition of mild heat to the bonded assemblies. This product also provides excellent adhesion and is flexible.

H.B. Fuller HL5200 is a reactive hot melt adhesive known for its wide range of application methods. It falls under the category of reactive chemistry and is suitable for use with silicone, polyurethane, and butyl tapes. This adhesive meets FGIA 800 standards. It is available in gray or black color and is designed for immediate handling in windows applications.

H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.

H.B. Fuller EV Bond 420 is a high-performance, two-part acrylate adhesive engineered to bond a wide range of plastics, metals, and composite assemblies. It offers outstanding bond strength, is extremely durable, and has excellent impact and weathering properties. EV Bond 420 greatly increases the reliability of finished assemblies, its ability to withstand extreme temperature fluctuations, and its resistance to a wide range of chemicals and environmental conditions. EV Bond 420GB allows control of the adhesive gap to a diameter of 0.25mm (0.01").

H.B. Fuller Ködispace 4SG, initially developed for structural glazing façades, is now widely used in insulating glass for both residential and commercial applications. Its unique material properties create highly durable and energy-efficient insulating glass units (IGUs). Unlike conventional thermoplastic spacers, Ködispace 4SG’s chemically bonds to both the glass and silicone edge seal, ensuring long-lasting energy efficiency and durability.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.