- Chemical Family:Epoxides, Epoxy & Epoxy Derivatives
- Product Type:Reactive Adhesive, Underfill Adhesive, 1K (1 component) Adhesive
- Application Area:Electronic Components, Wafer Bonding, Printed Circuit Boards, Chip Scale Packaging (CSP)
- Features:Fast Cure, Excellent Flowability, High Reliability
H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.