Products

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8014 is a reworkable, single-component epoxy underfill for fine-pitch chip scale packaging (CSP) and wafer-level packaging (WLCSP) assembly. It is heat curable and designed to improve reliability, with a fast cure time at a moderate temperature to minimize stress on components. This underfill is also reworkable without causing damage to the attach pad.