Products

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

Foster® Cryogenic Adhesive 82-77 is a chemically curing adhesive with the capability to achieve high tensile strength and adhesion at room temperature. It effectively bonds to a range of surfaces, including metal, wood, and masonry. This adhesive is supplied in a virtually 100% solids form, facilitating immediate bonding for non-porous surfaces without the risk of solvent entrapment issues.

H.B. Fuller FH8710 is a one-component epoxy adhesive that has excellent toughness and bonding strength. This halogen-free structural bonding adhesive has good mechanical properties and reliability properties. It has a very high bonding strength to multiple materials, especially inorganic materials.

H.B. Fuller 1521 is a two-component, room-temperature-cure silicone system. It has very low ionic content and can be used for electronic component applications and electronics potting. Its applications include appliance sealing, connector sealing, and junction box potting. Additionally, it has good thermal conductivity and flame retardancy.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH8017M is a black-colored epoxy-based underfill adhesive specifically designed for electronic components, including printed circuit boards (PCBs) and batteries. This ready-to-use product offers excellent flow properties, ensuring smooth and precise application. It provides good bonding strength, resulting in reliable and secure adhesion.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller 42327/52343 is a medium-hardness, semi-flexible, two-component polyurethane adhesive. It is designed for bonding applications requiring resilient bonds, non-sag application, and enhanced adhesion to flexible substrates. It is suitable for bonding metals, ceramics, natural rubber, thermosetting polymers, and select types of unprepared thermoplastic substrates such as ABS, polycarbonate, and nylon.