Products

Millennium Hurricane Force® 1-Part Flashing Adhesive is a highly elastomeric, one-part asphalt-modified urethane adhesive that is solvent-free and does not require mixing. The VOC content of the adhesive is less than 250 g/L. Millennium Hurricane Force® 1-Part Flashing Adhesive is approved for use in VOC regulated markets such as California and the OTC States.

H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller NP2075VF149 is a reactive hot melt adhesive known for its high performance and high green strength. As a one-component adhesive, it enables efficient manufacturing processes with high speed and low work-in-progress (WIP). It demonstrates excellent thermal stability during the production phase and boasts industry-leading heat resistance when exposed to in-lamp heat. This adhesive is primarily used for headlamp lens and housing bonding and exterior lighting applications.

Millennium LPS is a single component, elastomeric polyurethane, multi-use, sealant that is isocyanate free. Millennium LPS cures rapidly under the effect of atmospheric air and moisture to form a flexible and resistant joint with very good adhesion to most materials.

H.B. Fuller FH8707HF is a black-colored epoxy-based adhesive designed for a wide range of applications in electronic components, printed circuit boards (PCBs), electric motors, and automotive electrical and electronic systems. This heat-curable adhesive offers excellent filling properties, high strength, and good electrical properties. It exhibits improved aging resistance, ensuring long-term durability.

H.B. Fuller FH8710 is a one-component epoxy adhesive that has excellent toughness and bonding strength. This halogen-free structural bonding adhesive has good mechanical properties and reliability properties. It has a very high bonding strength to multiple materials, especially inorganic materials.

H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.

H.B. Fuller EA6405 is a one-component adhesive that can be cured by UV irradiation followed by thermal cure. It has fast UV curing and low-temperature heat curing with outstanding bond strength to PC substrates. This material is designed for structural bonding and has superior adhesion to a wide range of substrates, including plastics and metals such as PC, PMMA, aluminum, stainless steel, and other polar substrates.

Millennium Hurricane Force® 1-Part Membrane Adhesive is a highly elastomeric, one-part asphalt-modified urethane adhesive that is solvent-free and does not require mixing. The VOC content of the adhesive is less than 250 g/L. Millennium Hurricane Force® 1-Part Flashing Adhesive is approved for use in VOC regulated markets such as California and the OTC States.

H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.

GorillaPro® CA500RT is a black, medium-viscosity instant adhesive that is rubber-toughened with ethyl. It offers superior shock and thermal resistance when bonding rubbers, metals, and plastics, even in harsh environments. This adhesive demonstrates excellent strength and flexibility on a variety of substrates, making it a reliable choice for various applications.

Millennium 1-Part Pumpable Sealant is a state-of-the-art, single-component construction sealant that is solvent-free and suitable for general purpose use. Its unique formula, developed using the latest technology, ensures it is non-gassing, providing a solid filler profile for superior adhesion and durability. This sealant also exhibits excellent weathering properties, making it perfect for a range of applications.

H.B. Fuller FH8008 is a single-component, heat-curable, reworkable epoxy CSP/WLCSP underfill material. It’s designed for flowing quickly and filling the entire gap under the chip at room temperature. This material is easy to rework while possessing better adhesion and electrical properties.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.