- Product Type:Reactive Adhesive, Edge Bond Material, 1K (1 component) Adhesive
- Application Area:Electronic Components, Printed Circuit Boards
- Chemical Family:Epoxides, Epoxy & Epoxy Derivatives
- Features:High Reliability, Low Thermal Expansion, Fast Cure, High Glass Transition Temperature
H.B. Fuller FH8708T is a heat-curable, single-component epoxy material that can be repaired. It is designed to reinforce components with low CTE and high Tg, such as CSP/BGA. This corner bond material is specially created to enhance the reliability of CSP and BGA assemblies, with a fast cure at moderate temperatures that helps to minimize stress on components.