- Product Type:Epoxy Adhesive, Underfill Adhesive, 1K (1 component) Adhesive, Encapsulant
- Application Area:Flip Chip Applications, Printed Circuit Boards
- Features:Excellent Flowability, Good Adhesion, Electrically Insulating, High Reliability, High Glass Transition Temperature, High Modulus
H.B. Fuller FH8302 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8302 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.