- Chemical Family:Acrylics & Acrylates
- Product Type:1K (1 component) Adhesive, Conductive Adhesive, Reactive Adhesive
- Application Area:Electric Vehicle (EV), Electric Motors, Microelectromechanical Systems (MEMS) Applications, Optoelectronics Devices, Chip Module
- Application Method:Injection
- Features:Good Thermal Stability, Electrically Conductive, Good Bonding Strength, High Consistency, Low Outgassing, Fast Curing, Thermally Conductive, Low Temperature Curing
H.B. Fuller FH8801C is a fast-curing, single-component, electrically conductive adhesive designed for chip bonding in microelectronic, MEMS, and opto-electronic applications. This heat-curable material offers outstanding bond strength and snap cure during in-line production, making it ideal for automated assembly processes.