Products

Tonsan® TS856 is a kind of 2K PU structural adhesive, it is mainly used for composite materials bonding and can be cured at room temperature or can be accelerated with heating, after curing it has excellent adhesion, impact resistance, water resistance, electric isolation, and corrosion resistance properties.

Tonsan® AT 2641 is a 2K PU structural adhesive designed for composite materials bonding. It cures at room temperature or can be accelerated with heating, resulting in excellent adhesion, impact resistance, water resistance, electrical isolation, and corrosion resistance upon curing.

H.B. Fuller EP702 (FH8516) is a 2K epoxy adhesive. This adhesive is known for its room temperature curing properties, making it convenient and efficient for bonding applications. It is designed to provide high strength, excellent flexibility, and good impact resistance after curing. One of the notable features and benefits of H.B. Fuller EP702 (FH8516) is its versatility in bonding various substrates, including composites, metals, glass, and ceramics. The adhesive offers reliable bonding performance, ensuring strong and durable structures.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller U3349TX is a non-sag, UV-curable adhesive with a tack-free surface finish. It exhibits excellent bonding to a variety of plastics with a balance of strength, flexibility, and impact resistance. This adhesive is specifically designed for bonding a variety of plastics.

H.B. Fuller FH7013 is a 2K acrylate adhesive designed for structure bonding in portable devices. One of the key features of the H.B. Fuller FH7013 is its high strength and impact resistance. It also exhibits high temperature resistance, which is important in portable device applications where elevated temperatures can be encountered during operation or charging. Another advantage of H.B. Fuller FH7013 is its suitability for most substrates.

Tonsan® EP843 is an epoxy adhesive known for its high strength and heat resistance, capable of withstanding temperatures up to 150°C in the long term and 180°C in the short term. It has a high viscosity, making it suitable for potting bonding applications where thixotropic properties are desired, preventing flow on vertical surfaces. This adhesive is specifically designed for bonding metal and other parts in high-temperature and harsh conditions, making it ideal for use in the electric vehicle industry.

H.B. Fuller EY3010 is a two-part, thixotropic epoxy compound. It is designed for use with Shur-Lok fasteners to achieve high strength and dependable bonded inserts in honeycomb panels. The handling properties of these products are similar. However, the H.B. Fuller EY3010 is designed for the lowest weight. It is available within NASA limits because it has the low volatile content required for space applications. H.B. Fuller EY3010 A/B is qualified for LAC 30-8036A.

H.B. Fuller U3337 is a medium-to-high viscosity, UV-curable adhesive that is specifically designed for bonding a wide variety of plastics in a multitude of configurations. This adhesive is strong, flexible, and well-suited to bonding dissimilar substrates. In addition, it features a tack-free surface finish, which adds to its appeal for manufacturers.

H.B. Fuller FH7015 is a 2K acrylate adhesive. It is designed for structure bonding applications in portable devices. One of the notable features of the H.B. Fuller FH7015 is its high strength and impact resistance. This means that it can provide durable and reliable bonding between various substrates commonly found in portable devices.