- Product Type:2K (2 component) Adhesive, Encapsulant, Potting Compound
- Application Area:Printed Circuit Boards
- Chemical Family:Epoxy & Epoxy Derivatives
- Features:Low Moisture Absorption, High Dielectric Strength, High Temperature Performance
H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.