- Product Type:Radiation Curable Adhesive, 1K (1 component) Adhesive, Epoxy Adhesive
- Application Area:Electronic Components, Complementary Metal Oxide Semiconductor (CMOS), Charged Coupled Device (CCD)
- Chemical Family:Epoxy & Epoxy Derivatives
- Features:Fast Curing, Excellent Substrate Adhesion, UV Curable, Low Shrinkage
H.B. Fuller EA6402M is a one-component adhesive that can be cured by both UV and thermal methods. This adhesive has a fast curing time at 80℃, and also features low shrinkage, high adhesive strength, and the ability to adhere to a variety of substrates.