- Product Type:1K (1 component) Adhesive, Reactive Adhesive
- Application Area:Sensors
- Chemical Family:Epoxides, Epoxy & Epoxy Derivatives
- Features:Low Temperature Resistant, Low Temperature Curing, High Temperature Resistance, Fast Cure, Good Adhesion, Good Toughness, Low Shrinkage
H.B. Fuller FH8621 is a one-component, low-temperature-curing epoxy adhesive. It features fast curing at a low temperature, low shrinkage, high adhesive strength, and adhesion to a variety of substrates. FH8621 will cure faster with an increased temperature. Additionally, it offers high and low temperature resistance.