SILAPRENE® HAPs Free Sealant DC12781

Preparation of substrates:

• Surfaces to be bonded should be cleaned of all dust, oils or other contaminates. A solvent wipe is often adequate. Bonds to rigid surfaces are usually improved by a solvent wipe followed with light abrasion (180 grit), and another solvent wiping to remove abrasive residue. Dry surfaces thoroughly before applying adhesive.

Method of application:

• HAPs free Sealant DC12781 can be applied by ordinary caulking guns or pressure pumping equipment. Pumping equipment should be of the follower-plate type and have a pump ratio of at least 40:1. Cox, Aro, Binks, DeVilbiss, Graco and Lincoln all produce suitable equipment for handling this material.
• Silaprene HAPs free Sealant DC12781 is formulated for room temperature curing, and curing is initiated when a majority of the solvent has been evacuated from the bond line. Strength build-up is very fast in the early stages to give high holding power, with continued strength build-up over time.

Cleaner and thinner:

• Uncured material can be cleaned up with VMP Naphtha, Heptane, and Mineral Spirits. Thinning is not recommended. If a thinner product is deemed necessary for your application, contact your Royal Adhesives & Sealants salesman.