Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Benefits
Versatile application conditions:
- Shows high initial strength and fast setting which makes the product ideal for difficult to bond substrates.
- Low application temperatures from +120°C allow bonding of more heat sensitive materials. It also potentially provides energy cost savings.
- Suitable for profiles with tight curvatures.
Temperature resistance:
- High heat resistance after complete curing up to 150°C depending on the surface materials
- Good cold resistance
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Profile Wrapping
- Open time: Medium
- Materials: Wooden materials, plastics
- Green strength: High
- Application: Slot nozzle
- Pre heating: Yes
- Application temp: 120 - 140ºC
- Additional information: Specially recommended for low ambient temperatures
Packaging & Availability
- Regional Availability