Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features and Benefits
- One component; no mixing required
- Fast cure at 80°C
- Use for CCD/CMOS adhesion
- High and low temperature resistance
Applications & Uses
- Markets
- Applications
- Application Area
- Directions for Use
1. Prior to bonding, surfaces must be free of any dust, oils, or other contaminants.
2. Bring material to room temperature (25°C) before using (typical thaw time for 30ml syringes is 2-4 hours). We do not recommend thawing the material more than 3 times.
3. 9861-78 is sensitive to humidity; do not expose the material to air for an extended period of time. The recommended relative humidity during dispensing is <60%.
4. If the material is left idle in the syringe tip for an extended period of time, the tip should be purged or solvent cleaned.
5. Seal any remaining material and store immediately at -18°C.- Clean-Up
Equipment and any spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.
Properties
- Typical Physical Properties
Value Units Test Method / Conditions Hardness (cured 30 min, at 80°C) 80.0 - Shore D Elongation at Break (cured 30 min, at 80°C) 1.8 % - Shear Strength (cured 30 min, at 80°C) 19.0 MPa - Glass Transition Temperature (cured 30 min, at 80°C) 40.0 °C - Coefficient of Thermal Expansion (Alpha 1, cured 30 min, at 80°C) 66.0 m/m.°C - Coefficient of Thermal Expansion (Aplha 2, cured 30 min, at 80°C) 214.0 m/m.°C - Water Absorption (after 24 h, cured 30 min, at 80°C ) 0.12 % - - Electrical Properties
Value Units Test Method / Conditions Dielectric Strength 26.3 kV/mm - Dielectric Constant (at 1KHz) 3.2/0.02 - - Dielectric Loss (at 100kHZ) 3.3/0.03 - - Volume Resistivity 5.2 x 10¹⁵ Ω.cm - Surface Resistivity 1.9 x 10¹⁶ ohm - - Uncured Properties
Value Units Test Method / Conditions Specific Gravity 1.34 - - Viscosity 22000.0 cP - Thixotropic Index 4.6 - - Work Life (max. 60% RH) 3.0 days - - Typical Cured Properties
Value Units Test Method / Conditions Pot Life 3.0 days -
Technical Details & Test Data
- Cure Schedule
- Cure schedule:
- 4 minutes at 80°C
- 9861-78 will cure faster with increased temperature. The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.
- Cure schedule:
Packaging & Availability
- Regional Availability
- Storage Conditions
FH8621 should be stored at -18°C.
Shelf life is a 6 months from date of manufacture, in original unopened containers
Storage & Handling
- Shelf Life
- 6 Months