Enhanced TDS
Identification & Functionality
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Curing Conditions
Cure speed will vary with temperature, relative humidity, depth of material and presence of moisture. Some applications may require special surface preparation.
- General Instructions
- For best performance bond surfaces should be clean, dry and free of any contaminants and oils.
- Part A should be blended thoroughly before mixing with Part B in order disperse filler material evenly.
- Mix Parts A and B evenly according to the applicable mix ratio.
- Apply the mixture to the sealing or potting application. Automated dispensing equipment is recommended for electronics sealing and potting applications.
Properties
- Color (Properties)
- Physical Form
- Appearance
- White
- Component A
Value Units Test Method / Conditions Viscosity 7000.0 cP - - Component B
Value Units Test Method / Conditions Viscosity 25.0 cP - - Electrical Properties
Value Units Test Method / Conditions Volume Resistivity 1.0 x 10¹⁵ Ω.cm IEC60093, GB/T1692 Breakdown Voltage 23.0 kV/mm IEC 60243-1, GB/T1695 - Cured Properties
Value Units Test Method / Conditions Elongation at Break (50% RH) 110.0 % ISO37, GB/528 Hardness 40.0 - ISO7619, GB/T531, Shore A Tensile Strength (50% RH) 1.2 MPa ISO37, GB/528 Thermal Service Range - 50 - 150 °C - - Uncured Properties
Value Units Test Method / Conditions Fixture Time 45.0 min - Cure Schedule (50% RH) 7.0 days - Weight Mix Ratio 6:1 - - Working Time 8.0 min - Specific Gravity 1.4 - - Volume Mix Ratio 4:1 - -
Packaging & Availability
- Regional Availability
- Packaging Information
14kg
Storage & Handling
- Shelf Life
- 6 Months
- Storage Condition
Product shall be ideally store in a cool, dry area in unopened containers. Material should be stored at a temperature of 8 - 25ºC for a maximum. In the original unopened container. Do not return unused material back into the container.