FULLABOND WB18 is a versatile adhesive specifically developed for paper converting applications, including board lamination and side seaming of paper. This adhesive exhibits excellent wet tack properties and offers a fast setting speed, ensuring efficient bonding. It provides exceptional adhesion to a wide range of paper substrates and offers good water resistance, contributing to the durability of the final product. FULLABOND WB18 is a reliable choice for achieving strong and secure bonds in paper converting processes, making it suitable for various applications in the industry.

Compatible Substrates & Surfaces: Paper, Paperboard

Features: Excellent Substrate Adhesion, Fast Setting, Multi-Substrate Compatibility, Water Resistant, Wet Tack

Technical Data Sheet

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Identification & Functionality

Features & Benefits

Applications & Uses

Markets
Applications
Application Area
Compatible Substrates & Surfaces
Product Application

FULLABOND WB18 is an adhesive with good wet tack properties and fast speed of set providing excellent adhesion to a wide range of paper substrates with good water resistance.

Application Information
  • For optimum performance this product should be used within operating temperatures of 15°C to 30°C.
  • Ensure substrates are free form oils dirt or grease.
  • Clean up adhesive while wet with warm water.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (4/20/25°C)2,200 - 2,700cpsBrookfield
Solids Content24 - 28%-
Specific Gravityapprox. 1.06--

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Regional Availability
  • Australia & New Zealand (ANZ)

Storage & Handling

Shelf Life
6 months
Storage Condition

For optimum performance this product should be used within operating temperatures of 15°C to 25°C.Ensure substrates are free form oils dirt or grease.