FH8028F

Identification

GBU

EA

RTU Product Type

Underfill Adhesive,

1K (1 component) Adhesive,

Epoxy Adhesive

Categories

Markets → Electrical & Electronics → Applications → Packaging & Assembly → Adhesives & Sealants

Technologies → Adhesives & Sealants → Product Families → Bonding Technology → 1K Liquid Reactive Adhesives

Application Information

Cure Method

Heat Cure

Applications

Application Area

Chip Scale Packaging (CSP),

Wafer Level Chip Scale Package (WLCSP)

Features

Ready-to-Use Product Features

Good Adhesion,

Good Electrical Properties,

Fast Cure,

Reworkability

Features & Benefits

Product Highlights

• One component; no mixing required
• Fluorescent
• Fast cure at moderate temperatures
• Reworkable without damage to attach pads
• High reliability design for portable device

Packaging & Availability

Regional Availability

• Global

Packaging Information

10cc, 30cc, and 55cc syringe

Properties

Uncured Properties

	Value	Units	Test Method / Conditions
Specific Gravity	1.28	-	-
Viscosity (at 25°C, 50 rpm)	350	cPs	-
Work Life (at 25°C)	2	days	-

Cured Properties

	Value	Units	Test Method / Conditions
Coefficient of Thermal Expansion (α₁,material cured 150°C/30min)	50	ppm/°C	-
Coefficient of Thermal Expansion (α₂, material cured 150°C/30min)	185	ppm/°C	-
Glass Transition Temperature (material cured 150°C/30min)	125	°C	-
Storage Modulus (at 25°C, material cured 150°C/30min)	3,000	MPa	-

Specifications

	Value	Units	Test Method / Conditions
Storage Temperature	-20	°C	-

Storage & Handling

Storage Conditions

FH8028F should be stored at -20°C. Shelf life is 6 months from date of manufacture, in original unopened containers.

Shelf Life

6 months

Technical Details & Test Data

Recommended Cure

• 150°C for 10 minutes
• The curing temperature and curing time should be adjusted according to the heating device and the material to be bonded.