Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Characteristics
- Suitable for high speed and precise applications
- Non-tainting for confectionary
- Low application temperature
Applications & Uses
- Typical Applications
Developed as a low application temperature mPO based packaging adhesive, with good general purpose performance and is suitable for high speed applications.
- Application Instructions
Recommended application temperature: between 110°C and 140°C depending upon the application conditions and substrates to be bonded. All our hot melt adhesives are formulated to minimise the risk of degradation at elevated temperatures. However, to ensure clean running keep to the suggested application temperature, check thermostats regularly and never exceed 200°C.
Properties
- Physical Form
- Appearance
- Water white Pastilles
- Typical Properties
Value Units Test Method / Conditions Viscosity (at 120°C) 1295 cPs Brookfield Softening Point 90 °C - Molten Tack Medium - - Adhesive Open Time Short - -
Storage & Handling
- Shelf Life
- 3 years
- Storage Conditions
In original sealed packaging protected from sun, dust, moisture, and high temperatures. Clean and dry conditions above +5°C and below +30°C. Use oldest stock first.