Weld Mount AT-6030

• Weld Mount AT-6030 adhesive is a two-component, 10:1 mix ratio structural adhesive with outstanding adhesion for bonding metals, carbon fiber, composites and most plastics.
• Most metals can be bonded without priming.
• This advanced product is designed to meet specific requirements of the transportation industry, including reduced read through on show surfaces.
• The combination of minimum surface preparation, primerless metal bonding and low read through makes AT-6030 ideal for a variety of assembly operations.
• AT-6030 is packaged in 40ML cartridges for use with our AT-300 dispensing gun and AT-650 mixing tips.
• Primerless metal bonding
• Reduced read through
• Good environmental resistance
• Non-sag formulation
• Excellent strength
• Impact resistant
• 100% reactive
• Room temperature cure
• Easily applied
• AT-6030 bonds to:
  • Metals: Aluminum, Steel, Stainless steel, Coated metals
  • Thermo sets: Fiberglass, Phenolics, Gel coats, Epoxy, Liquid molding resins, SMC
  • Thermo plastics: Acrylics, ABS, Polycarbonates, PVC's, Styrene's, Peek's, PBT Blends, PET Blends
• Substrate : Metal Carbon
• Best for Metal Bonding 10:1 cartridge
• Dispense Gun : AT-301
• Static Mix Tip : AT-650 3.5" Mix Tip

• Adhesive components and mixed adhesive should beremoved from surfaces with a suitable industrialsolvent or cleaner before the mixed adhesive cures.
• Once the adhesive cures, soaking in a strong solventor paint remover will be required to soften theadhesive for removal.
• Any clean-up of the bondedassembly using industrial solvents is notrecommended as it could affect the cure.

• The need for surface preparation must be determined bycomparative testing of prepared and unprepared substratesto assure that unprepared bonding is equivalent to oracceptable for the application relative to prepared bonding.
• Initial bonding tests must be followed up with simulated oractual durability tests to assure that surface conditions do not lead to degradation of the bond over time under service conditions.
• Subsequent changes in substrates or bonding conditions will require re-testing.
• Prepare metals forbonding by removing dust, loose scale, rust, and other surface residue including oil and grease.
• For maximum bond strength on steel, abrade surface prior to bonding.

• The user must determine the suitability of a selectedadhesive for a given substrate and application.
• Associated Technologies strongly recommends laboratory, shop andend-use testing that simulates the actual manufacturingand end-use environment.
• Most thermoplastics can bebonded with no surface preparation other than a dry wipeor air blow-off.
• If contamination is visible or suspected,wipe with alcohol prior to bonding. Polyolefins,thermoplastic polyesters, fluorocarbon plastics and otherlow surface energy plastics are generally not bondable.
• Testing is required on thermoset plastics because of thewide variations in compositions

• Open working time is the approximate time after mixing components A and B, depending on bonding conditions, that the adhesive remains fluid andbondable.
• Fixture time is the approximate time aftermixing components A and B required for the adhesiveto react the partial state of cure necessary to allowcareful movement, unclamping or de-molding of assembled parts.
• Parts can generally be put in servicewhen 80 percent of full strength is developed.
• The time to achieve 80% cure is approximately 2-3 times thatrequired for fixturing.
• The working and fixture timespresented in this bulletin are based on laboratory tests performed at 75°F/24°C.
• Higher temperatures speedthe curing reaction and reduce open working time.

• EXOTHERM: The chemical curing reaction that occurswhen components A and B are mixed generates heat.
• The amount of heat generated is controlled by themass and thickness of the mixed product.
• Large masses over 1/2 inch thick can develop heat in excessof 250°F/121°C and can generate harmful, flammablevapors.
• Large curing masses should be carefully moved to a well-ventilated area where the chance ofpersonal contact is minimized.

AT-6030 is conveniently packaged in 40 Ml cartridges.

• The shelf life of components A and B in unopened containers is approximately six months from the date the product is shipped from
• Associated Technologies facility. Shelf life is based on steady state storage between 55°F and 80°F (13°C and 27°C).
• Exposure, intermittent or prolonged, above 80°F (27°C) will result in a reduction of the stated shelf life.
• Exposures above 100 ºF (38 ºC) during shipping or storage can quickly degrade component B in cartridges or bulk containers, and must be prevented.
• Shelf life of both components can be extended by air-conditioned or refrigerated storage between 50°F and 65°F (10°C and 18°C).
• Keep from freezing.