Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Application Instructions
- Application method: hot melt adhesive applicators.
- Processing temperature:
- nozzle applicator: 190 - 200°C
- hot melt gun: 190 - 200°C
- roll coater: 160 - 190°C
- For optimum results, substrates shall be clean and dry and free from dust and grease. Climatization of the substrates to room temperature (minimum 18°C) is highly recommended.
- This hot melt can be applied by hot melt adhesive gun, automatic nozzle applicator as well as a roller applicator. The working temperature varies with the use of applicator and the materials. The bonding should happen immediately after the application. The initial adhesion is good.
- The bonded materials can be used for further processing after a short cooling period. Preliminary trials should be made to ensure the suitability of the hot melt adhesive to bond the substrates being worked.
Properties
- Color (Properties)
- Typical Properties
Value Units Test Method / Conditions Softening Point (Mettler) approx. 153 °C - Density approx. 0.97 - - Viscosity (at 180°C) approx. 5700 mPa.s Brookfield CAP 2000
Safety & Health
- Safety Information
At the recommended working temperature, the hot melt will cause burns in contact with skin. Do not inhale fumes that are released at the working temperature. In any case, a suitable exhausting system shall be installed in the working area.
Packaging & Availability
- Regional Availability
Storage & Handling
- Shelf Life
- 18 Months
- Storage Condition
In original sealed packaging in a clean and dry conditions at room temperature.