Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Cure Method
- Processing
Processing
Consistency
Non-sagging Pasty Surface requirements
Dry Clean free of grease free of dust Surface Cleaning
Körasolv PU Körasolv WL Adhesion Promoter (absorbing surface) Körabond HG 92
Adhesion Promoter (non absorbing surface) Körabond HG 81
Product Overpaintability after skin formation (depending on paint)
Cleaning Cleaner for Tools Körasolv PU Hints
Resistance against UV Radiation Not suitable for glass bonding with permanent UV radiation to the bonding area.
Stress Cracking Preliminary tests must be carried out on plastics with a tendency to stress cracking. (PMMA, ABS, PC or PS)
Compatibility with Polystyrene Foams Not suitable for bonding polystyrene foams.
Avoid Contact with Isocyanate Reactive Substances Avoid direct contact with isocyanate reactive substances, especially alcohol such as spirit, dilutions,
cleaning compounds and fission products of silane-modified polymers or silicones until the adhesive has attained full cure. This will prevent the adhesive from curing properly.- Preparation: For some substrates the use of mechanical pretreatment and/or cleaner or primer is necessary to achieve good adhesion.
- Processing: Low temperatures can cause a temporary increase in viscosity resulting in reduced extrusion and slower curing rates.
- Cleaning: Clean tools immediately after use. Once cured, the material can only be removed mechanically.
- Dimensioning: The required thickness of the adhesive layer depends on the expected maximum strength and joint movement. We recommend a minimum layer thickness of 2 mm.
Properties
- Physical Form
- Physical Properties
Value Units Test Method / Conditions Density 1.4 g/cm³ - - Cured Properties
Value Units Test Method / Conditions Skin Formation Time 45.0 min Kö-test method 100109, Climate according to DIN 50014 Curing to Depth 3.0 mm/d within first 24 h; Climate according to DIN 50014 Change in Volume -3.0 % DIN EN ISO 10563 Hardness (after 28d, thickness of specimen = 6 mm) 50.0 - DIN ISO 7619-1, Shore A Tensile Strength 3.0 MPa DIN EN ISO 527 Elongation at Break 650.0 % DIN EN ISO 527 Tear Strength 11.0 N/mm ISO 34-1 - Processing Parameters
Value Units Test Method / Conditions Processing Temperature 15 - 35 °C - Required Squeezing Pressure 2 - 5 bar - Recommended Minimum Layer Thickness 2.0 mm - - Recommended Operating Conditions
Value Units Test Method / Conditions Service Temperature - 40 - 90 °C - Short-Term Temperature Resistance (60 min) 120.0 °C -
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Regional Availability
Storage & Handling
- Storage Condition
Storage Temperature: 5°C to 25°C