Enhanced TDS
Identification & Functionality
- Chemical Family
- Polymer Name
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Typical Applications
PHOTOCAP® 6048 is typically used in thin film module constructions to protect the device against moisture ingress.
- Lamination Instructions
- Platen temperature: 140 - 150°C
- Evacuation Time: 180 - 300 seconds
- Cure Time: 300 - 360 seconds
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Tensile Strength 9.0 MPa ASTM D638 Ultimate Elongation 750.0 % ASTM D638 Adhesion (Glass) min. 100 N/cm HBF Moisture Vapor Transmission Rate max. 7 g/m²/24 hrs AFTM F1249 Water Absorption max. 0.1 wt.% ASTM D570 Optical Transmission min. 87 % ASTM E424 UV Cut-off 360.0 nm ASTM E424 Shrinkage max. 5 % IEC 62788 Volume Resistivity min. 1 x 10¹⁶ Ohm cm ASTM D257 Dielectric Strength min. 30 KV/mm ASTM D149 Comparative Tracking Index 600.0 V IEC 60112
Regulatory & Compliance
- Regulatory Information
PHOTOCAP 6048 is in the process of being UL listed. This product is in category QIHE2 Photovoltaic Polymeric Materials, H.B. Fuller file number E310488.
Safety & Health
- Safety Information
Avoid contact with skin and eyes. Product will irritate eyes if contact occurs. Skin irritation is possible on prolonged or repeated contact.
Packaging & Availability
- Regional Availability
Storage & Handling
- Storage Conditions
Clean and dry conditions below 40°C and 70% RH. For best performance, the product should be stored and used at 65°F – 85°F. Do not freeze.