Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Features and Benefits
- Halogen free•
- RoHS compliant
- Low odor and non-corrosive
- Excellent thermal conductivity
- Flame retardancy can meet UL94-V0
- High adhesion to a variety of materials including, FRP, FR4, solder mask, glass, aluminum and composites
- Excellent weather and high temperature resistance
- Fast cure when heated
Applications & Uses
- Applications
- Application Area
- Cure Method
- Typical Applications
- Electronics potting
- Electronics thermal interface material
- Inverter potting
- Power device potting
- General Instructions
a) For best performance bond surfaces should be clean, dry and free of any contaminants and oils
b) Part A and Part B should be blended respectively before mixing in order to make filling material distribute evenly
c) Mix evenly according to the ratio
d) Potting must be finished during the working time
e) Working time and Cure speed will vary with environment temperature
f) Moving after initial gelation and testing after full cure
g) Recommended using automatic dispensing equipment to applying the potting compound
Properties
- Color
- Physical Form
- Component A
- Component B
- Electrical Properties
- Cured Properties
- Uncured Properties
- Note
Test Sample Conditions:
2mm Thickness, Cured at 50±2ºC for 40min. Tested at 23±2ºCThe values noted in this data sheet are typical properties only and are not intended to be used as material specifications. For assistance in writing a material specification, please contact H.B. Fuller Company for further details.
| Value | Units | Test Method / Conditions | |
| Viscosity | 4000 - 5000 | cP | - |
| Value | Units | Test Method / Conditions | |
| Viscosity | 3000 - 4000 | cP | - |
| Value | Units | Test Method / Conditions | |
| Volume Resistivity | 1.0 x 10¹⁵ | Ω.cm | GB/T1692 |
| Value | Units | Test Method / Conditions | |
| Thermal Service Range | - 60 - 210 | °C | - |
| Hardness | 58.0 | - | GB/T531, Shore A |
| Tensile Strength (50% RH) | 1.8 | MPa | GB/528 |
| Thermal Conductivity | 0.8 | W/m.K | DIN EN 821 |
| Elongation at Break (50% RH) | 90.0 | % | GB/528 |
| Value | Units | Test Method / Conditions | |
| Volume Mix Ratio | 1:1 | - | - |
| Weight Mix Ratio | 1:1 | - | - |
| Specific Gravity | 1.6 | - | - |
| Cure Schedule (at 120°C) | 10.0 | min | - |
| Working Time | 1.0 | h | - |
| Cure Schedule (at 25°C) | 24.0 | h | - |
| Cure Schedule (at 50°C) | 40.0 | min | - |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Curing Conditions
Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of 2530 silicone adhesive. Most notable of these include: organo-tin and other organometallic compounds; silicone rubber containing organo-tin catalyst; sulfur, polysulfides, polysulfones or other sulfur containing materials, amines, urethanes or amine containing materials, unsaturated hydrocarbon plasticizers; some flux residues. Cure performance should be checked on all substrates contacting the adhesive. Cure speed will vary with temperature, relative humidity, depth of material and presence of moisture. Some applications may require special surface preparation. Contact H.B. Fuller Company technical support for additional curing recommendations.
Packaging & Availability
- Regional Availability
- Ordering Information
Stock No.
- A: 25320405A, 25kg
- B: 25320405B, 25kg
Storage & Handling
- Storage Conditions
Product shall be ideally store in a cool, dry area in unopened containers. Material should be stored at a temperature of 8-25°C for a maximum shelf life of 6 months in the original unopened container. Do not return unused material back into the container.