Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Cure Method
- Curing Conditions
Cure speed will vary with temperature, relative humidity, depth of material and presence of moisture. Some applications may require special surface preparation. At 21 - 25°C, 45 - 55% relative humidity, typical cure depth is 2mm in 24 hours. Requires more time to cure in colder or lower humidity conditions.
- General Instructions
- For best performance bond surfaces should be clean, dry and free of any contaminants and oils.
- Apply a continuous and even bead of silicone to one surface.
- Assemble parts immediately. Remove excess material quickly.
Properties
- Color (Properties)
- Physical Form
- Electrical Properties
Value Units Test Method / Conditions Volume Resistivity 1.0 x 10¹⁴ Ω.cm IEC60093 Breakdown Voltage 15.0 kV/mm IEC 60243-1 - Technical Data
Value Units Test Method / Conditions Viscosity 15,000 - 30,000 cP - Specific Gravity 1.21 - - - Cured Properties
Value Units Test Method / Conditions Thermal Service Range - 54 - 210 °C - Hardness 35.0 - ISO7619, Shore A Tensile Strength (at 21 - 25°C, 50% RH) 1.5 MPa ISO37 Elongation at Break (21 - 25°C, 50% RH) 150.0 % ISO37 Lap Joint Shear Strength (at 21 - 25°C, 50% RH, Aluminum) 0.5 MPa ISO4587 - Uncured Properties
Value Units Test Method / Conditions Tack Free Time 5 - 20 min - Full Cure Time (min. 2mm) 24.0 h -
Packaging & Availability
- Regional Availability
- Packaging Information
310ml Cartridge
Storage & Handling
- Storage Condition
Product shall be ideally store in a cool, dry area in unopened containers. Material should be stored at a temperature of 8 - 25°C. Do not return unused material back into the container.